Las Vegas, NV – Jan. 2017 – MERA, a leading global provider of software development and maintenance services, attended a global consumer electronics and consumer technology tradeshow (CES). CES 2017 marked its 50th anniversary and attracted more than 3600 companies to the exhibition.
MERA happened to be among the participants of CES amid its partnership with DSP Group established in 2016. One of MERA engineers engaged in the joint project assisted DSP Group with the demonstration of the Android Board Support Package on the DSPG Evaluation Boards. The technologies showcased by DSP Group captured the interest among the company's current and potential clients who visited its suite. “The newly launched DVF101 and the DVF1100 advanced video processing platforms are aimed at creating a new product category of high-quality voice and video over IP Android terminals”, said Mr. Ran Klier, Corporate Vice President of Sales and Marketing Europe and Americas for DSP Group.
Bill Timm, VP of Business Development at MERA, also had a chance to discuss the project's insights with the interested parties during CES. Several Tier-1 and Tier-2 vendors demonstrated considerable interest in the BSP designed by MERA. “Overall activity in the DSPG suite was quite remarkable with a large number of customers coming through and attending the DVF demo. Later, during business discussions, some of the companies revealed to me their plans to design an Android phone based on the DSPG’s new hardware platform.It means that there is a high chance they will need MERA’s BSP and possible help”, comments Bill Timm.
About DSP Group
DSP Group®, Inc. (Nasdaq: DSPG) is a leading global provider of wireless chipset solutions for converged communications. Delivering semiconductor system solutions with software and hardware reference designs, DSP Group enables OEMs/ODMs, consumer electronics (CE) manufacturers, and service providers to cost-effectively develop new revenue-generating products with fast time-to-market. www.dspg.com